The global 3D integrated circuits for computing market was valued at USD 3.5 billion in 2020 and is projected to reach USD 9.2 billion by 2025, growing at a CAGR of 21.5% during the forecast period.

Global Data Insights Consultancy announces the release of the report "Global 3D Integrated Circuits for Computing Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2034”. This report provides a detailed overview of the market scenario, including a thorough analysis of the market size, sales quantity, average price, revenue, gross margin and market share. The report provides an in-depth analysis of the competitive landscape, manufacturer's profiles, regional and national market dynamics, and the opportunities and challenge that the market may be exposed to in the near future. Global 3D Integrated Circuits for Computing Market research report is a comprehensive analysis of the current market trends, future prospects, and other pivotal factors that drive the market.

The report presents authenticated data derived from extensive primary and secondary research. By analysing historical growth trends and the current market landscape, it aims to provide actionable insights and forecasts for global and regional market growth. It takes into account revenue generated from report sales and related technologies across various application segments while exploring market data tables. Key market factors, including macroeconomic conditions, the overall market environment, government policies, and the competitive landscape, are carefully examined to ensure a comprehensive analysis.

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Competitive Landscape:

Some of the major players in the 3D Integrated Circuits for Computing Market are:

1. TSMC
2. Samsung Electronics
3. Intel Corporation
4. AMD (Advanced Micro Devices)
5. Broadcom Inc.
6. Qualcomm Technologies
7. SK Hynix
8. Micron Technology
9. NVIDIA Corporation
10. ASE Technology Holding
11. Amkor Technology
12. Toshiba Corporation
13. STMicroelectronics
14. Texas Instruments
15. IBM Corporation
16. ASML Holding
17. MediaTek Inc.
18. Infineon Technologies
19. NXP Semiconductors
20. GlobalFoundries

Recent Development:

In May 2025, TSMC announced plans to establish a new chip design center in Munich, Germany, set to open in the third quarter of 2025. This facility aims to support European clients in developing high-density, high-performance, and energy-efficient chips, focusing on applications in automotive, industrial, artificial intelligence (AI), and Internet of Things (IoT) sectors. This initiative complements TSMC’s ongoing project in Dresden, Germany, where it collaborates with Infineon, NXP, and Robert Bosch to build a new microchip manufacturing facility called the European Semiconductor Manufacturing Company (ESMC).

In early 2025, AMD announced the Ryzen 9000 HX-Series processors, featuring 2nd Generation AMD 3D V-Cache™ technology. These processors are designed to deliver exceptional gaming and content creation performance in laptops, combining high CPU core performance with advanced graphics capabilities.

In November 2023, Samsung launched its new 3D chip packaging technology, SAINT, which includes three variants: SAINT S, SAINT D, and SAINT L. These are designed to improve the performance and integration of memory and processors for high-performance chips, including AI applications.

In September 2023, TSMC introduced 3Dblox 2.0, an open standard designed to enhance 3D IC design efficiency. This standard enables early architecture exploration, facilitating power and thermal feasibility studies, and supports chiplet design reuse features like mirroring to improve design productivity.

In March 2023, Intel introduced its advanced stacked 3D IC processors utilizing Through-Silicon Via (TSV) technology. These processors offer enhanced computing power and energy efficiency, marking a significant step in high-performance computing.

In July 2023, AMD launched its Monolithic 3D IC graphics cards, integrating multiple layers of circuitry into a single chip. This innovation delivers exceptional graphics performance and computational capabilities, revolutionizing the gaming and graphics industry.

3D Integrated Circuits for Computing Market Segmentation

By Technology Outlook (Revenue, USD Billion, 2020 – 2034)

Through-Silicon Via (TSV)

Monolithic 3D IC

3D Fan-Out Packaging

Silicon Interposer Technology

Die-to-Die Bonding

By Component Outlook (Revenue, USD Billion, 2020 – 2034)

Memory

Processor

Sensor

LED

Others (Power Management ICs, Logic Circuits)

By Application Outlook (Revenue, USD Billion, 2020 – 2034)

High-Performance Computing (HPC)

Artificial Intelligence (AI) and Machine Learning

Data Centers

Consumer Electronics

Automotive Electronics

Internet of Things (IoT) Devices

Telecommunication Equipment

By End-User Industry Outlook (Revenue, USD Billion, 2020 – 2034)

IT & Telecom

Consumer Electronics

Healthcare

Automotive

Defense and Aerospace

Industrial Manufacturing

By Integration Type Outlook (Revenue, USD Billion, 2020 – 2034)

3D Stacked ICs

3D Wafer-level Packaging

3D System-in-Package (SiP)

3D Integrated Circuits for Computing Market Regional Analysis

North America (USA and Canada)

Europe (UK, Germany, France and rest of Europe)

Asia-Pacific (China, Japan, India, and Rest of Asia Pacific)

Latin America (Brazil, Mexico, and Rest of Latin America)

Middle East and Africa (GCC and Rest of the Middle East and Africa)

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Important Features of the reports:

- Detailed analysis of the 3D Integrated Circuits for Computing Market

- Fluctuating market dynamics of the industry

- Detailed 3D Integrated Circuits for Computing Market segmentation

- Historical, current and projected market size in terms of volume and value

- Recent industry trends and developments

- Competitive landscape of the 3D Integrated Circuits for Computing Market

- Strategies of key players and product offerings

- Potential and niche segments/regions exhibiting promising growth

- A neutral perspective towards 3D Integrated Circuits for Computing Market performance.

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